分子生物学
IVD分子诊断
细胞培养与分析
蛋白研究
细胞因子
重组蛋白
抗体
高通量测序建库
病原检测UCF系列
生物医药
工具酶
抑制剂激活剂与常用试剂
仪器
耗材

Plasma electrolytic oxidation of Al–Cu–Li alloy: film defects induced by intermetallic particles

Yuheng Li, Yuchen Wang, Longfei Weng, You Lv, Zehua Dong, Xinxin Zhang

Journal:APPLIED SURFACE SCIENCE

IF:6.6

DOI:10.1016/j.apsusc.2026.168001

PMID:

Published:2026-07-31

research field:药理学免疫学炎症研究肺病学纳米医学

Abstract

PEO film growth exhibits a preference for the matrix over IMPs. • IMP-associated defects compromise PEO film integrity and thus its corrosion resistance. • Alkaline etching pretreatment benefits the corrosion resistance of PEO film. Third-generation Al–Cu–Li alloys exhibit high specific strength but suffer from high corrosion susceptibility. While plasma electrolytic oxidation (PEO) films provide corrosion protection for Al–Cu–Li alloys, their barrier integrity may be compromised by coarse intermetallic particles (IMPs). Based on quasi-in-situ high-resolution electron microscopy and electrochemical analysis, the present study reveals that IMPs are selectively excluded during the PEO process. This exclusion leads to the local films with compromised thickness and compactness, with the degradation further exacerbated by Cu redistribution, which, consequently, results in reduced corrosion resistance. To address these issues, alkaline etching pretreatment was proposed, effectively reducing the surface density of IMPs and thus significantly restoring the initial barrier integrity and enhancing the corrosion resistance of the resulting PEO film. Specifically, compared to the polished state, the corrosion current density of the PEO film on the etched substrate decreases by ∼3.5-fold (from 1.13 × 10 −7 A/cm 2 to 3.29 × 10 −8 A/cm 2 ), while the total impedance increases by an order of magnitude (from 1.48 × 10 5 Ω·cm 2 to 1.51 × 10 6 Ω·cm 2 ). Download: Download high-res image (164KB) Download: Download full-size image

本文使用的Yeasen产品

购物车
客服
转染试用